Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Interconnects of Printed Wiring Assemblies
This dissertation investigates the durability of solder interconnects of area array packages mounted on Printed Wiring Assemblies (PWAs) subjected to dynamic flexural loads, using a combination of testing, empirical curve fitting and mechanistic modeling.This is followed by a discussion of the drawbacks of these test methods specific to quantifying solder interconnect durability. Board level drop testing is then reviewed extensively, with a focus on the test technique and failure site transitionsanbsp;...
| Title | : | Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Interconnects of Printed Wiring Assemblies |
| Author | : | Joseph Varghese |
| Publisher | : | ProQuest - 2007 |
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